Events: Details

2009 NCN@Purdue Summer School: Electronics from the Bottom Up

Category: conference/workshop
Description: Electronics from the Bottom Up seeks to bring a new perspective to engineering education -- one that is designed to help realize the opportunities of nanotechnology. Ever since the birth of solid-state physics, materials have been described in terms of average material parameters like the mobility or the optical absorption coefficient, which are then used as inputs to macroscopic device models. This two-step approach is still widely used, even for modern nanostructured materials, but we believe that it is no longer adequate to address the problems of our day. An integrated approach that embeds new ways of thinking, emerging from current research on nanoscience, directly into the models used for non-equilibrium problems like nanoscale transistors, energy conversion devices and bio-sensors is needed. The objectives of this initiative are to define and disseminate the fundamentals of this novel viewpoint through a carefully coordinated collection of seminars, short courses and full-semester courses. A growing collection of resources for educators and self-learners is already at Each summer, we conduct a two-week summer school to give students, faculty, and professionals an opportunity to participate in the development of Electronics from the Bottom Up. [[BR]] The one-week 2009 Summer School will focus on percolative transport and reliability for nanostructured electronics devices with additional sessions on graphene electronics. The format will be: [[BR]] Mornings: Nanostructured Electronics Devices: Percolation and Reliability, by M. A. Alam [[BR]] Afternoons: Colloquium on Graphene Physics and Devices by S. Datta, M. Lundstrom and J. Appenzeller
When: Monday 20 July, 2009 8:00 am EDT - Friday 24 July, 2009 5:00 pm EDT
Where: Purdue University, West Lafayette, IN
  1. 2d/3d nets
  2. bottom up approach
  3. devices
  4. graphene
  5. nanoelectronics
  6. NEGF
  7. NEGF Theory
  8. percolation
  9. reliability
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