Coral Name: CMP
Max Wafer Size: 8 in.
Chemical mechanical polisher (CMP) used to polish and planarize wafers and piece-parts. Can be used for both metals and dielectrics.
8" diameter wafer to single IC capability Automated process ocntrol for repeatable results Various process parameters such as: platen rotational speed; carrier rotational speed, down force, and back pressure; carrier sweep speed and linear travel; platen temperature; slurry flow rate; in situ conditioning of polishing pad
* Must install Coral and be a trained user to reserve a slot on this system.