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Equipment

Logitech Chemical Delayering and Planarization System

Equipment home > Biology > Logitech Chemical Delayering and Planarization System

General Information:

Coral Name: CMP
FIC: Shared
Process/Equipment Owner:
Location: 2031
Max Wafer Size: 8 in.

System Information:

General Description:

Chemical mechanical polisher (CMP) used to polish and planarize wafers and piece-parts. Can be used for both metals and dielectrics.

Capabilities:

8" diameter wafer to single IC capability Automated process ocntrol for repeatable results Various process parameters such as: platen rotational speed; carrier rotational speed, down force, and back pressure; carrier sweep speed and linear travel; platen temperature; slurry flow rate; in situ conditioning of polishing pad

Materials Compatibility:

Misc.

Useful Links:

* Must install Coral and be a trained user to reserve a slot on this system.