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Welcome to the Thermal Properties group! If you are a student or practicing engineer or scientist who wants to learn more about thermal properties or an instructor looking for materials to use in a course, you can find material here that includes complete courses and seminars on specialized topics.
You may also want to check out thermalHub.
Much of the material is freely accessible by any visitor, but by joining this group, you can participate in discussions on topics of interest to you. Additionally, as a group member you may receive notifications about new materials and events of interest to the thermal properties group members.
You can also contribute substantial resources to nanoHUB through the resource contribution process, and then send a message to the group manager so that links to those resources can be added to this group.
This group contains the following:
Purdue University (2013) 30 Lectures
Taught by Timothy S Fisher
Selected Topics: lattice structure, phonons, electrons, carrier statistics, thermal properties, Landauer transport, carrier scattering, transmission
ECE 598EP at the University of Illinois Urbana-Champaign (2009) 15 Lectures.
Taught by Eric Pop
Selected Topics: hot chips, electrons, phonons, thermal conductivity, boundary resistance, thermometry, conductance quantization, power dissipation in semiconductors
Purdue University (2011). 2 Lectures.
Taught by Timothy S. Fisher
Selected Topics: thermal transport, conductivity, interfaces, phonons, electrons, Landauer, ballistic interface resistance, carrier scattering
This lecture covers the following topics:
Background & Motivation: Thermal Management Landscape, Computing Trends and Challenges, Energy Implications
Thermal Management Basics: Thermal Packaging Architecture, Review of Heat Transport Resistances
Advanced Thermal Management Strategies: Vapor Chamber Heat Spreaders, Microchannel Heat Sinks
Thermal Simulation Tools
nanoMATERIALS nanoscale heat transport
This tool will enable the users to run thermal conductivity simulations on various Si/Ge structures by non-equilibrium MD with LAMMPS package. Pure Si/Ge bulks, pure Si/Ge square nanowires, or supperlattice Si/Ge nanolaminates and nanowires with different periodicity can be selected from the prebuilt structures. Also, users can create Si/Ge supperlattice structures with different sizes and the number of priods by their own. In addition to thermal conductivity, energies, temperature profiles, and atomic trajectories during the simulation will also be output.
Thermophotovoltaic Efficiency Simulation
This tool allows users to simulate and optimize TPV performance when using these components at a system level. Users specify the materials and the geometric structure of the selective emitter, filter, and TPV diode. This information is subsequently supplied to two simulations: a finite difference time-domain simulation, known as MEEP, which yields the thermal emission spectrum of the photonic structure; and a Fourier modal method simulation, known as S4, which outputs the filter spectrum. Both of these results are then combined with other data provided in the GUI to yield the overall TPV system efficiency.
hotSPICE is a linear thermal circuit simulation tool. Resistors, capacitors, temperature sources and heat sources can be used in any combination to model thermal problems. Both steady-state and transient analyses can be performed. Plots can be generated for temperature at any node in the circuit, as well for heat transfer across any temperature source. hotSPICE is intended for undergraduate heat transfer students.
Modeling Thermal Interaction between Laser Light and AFM
We find that a small change in the size of the AFM cantilever caused by thermal expansion from the laser is measureable. Our simulated results suggest that both the laser power and spot positions significantly change the resonant response of the cantilevers. AFM cantilevers are resonated during the tapping mode.
1-D Chain of atoms, bases and layers to produce phonon dispersion. This tool is an eigenvalue solution for phonon dispersion in a 1D chain of atoms, bases and layers with a constant harmonic potential. You can design a 1D system of arbitrary masses with multiple bases. No attempt has been made to separate the branches.
Simple 1D Finite Difference Method Tool for Undergraduate Heat Transfer Course. This tool solves 1D conduction heat transfer problems. It uses boundary condition types 1, 2 and 3, but does not include generation. This tool is meant to be an educational tool for an undergraduate heat transfer course.