Support Options

Submit a Support Ticket

Home Presentation Materials Thermal Conductance of solid-Solid and Solid-Liquid Interfaces About

Thermal Conductance of solid-Solid and Solid-Liquid Interfaces

By David G. Cahill

University of Illinois at Urbana-Champaign

Published on


cahill The thermal conductance of interfaces is a key factor in controlling thermal conduction in nanostructured materials, composites, and individual nanostructures. We have recently advanced the state-of-the-art of time-domain-thermoreflectance (TDTR) measurements of thermal transport and are using TDTR to study heat transport across individual interfaces with extremely high and low thermal conductance; and heat transport in nanoscale W/alumina multilayers that circumvent the lower-limits for homogeneous materials imposed by the minimum thermal conductivity. The 3 μm spatial resolution of our TDTR measurements also enables rapid high-resolution imaging of the thermal conductivity of complex microstructures and combinatorial samples. Heat transport in suspension of carbon nanotubes and metal nanoparticles are studied by picosecond transient absorption. Most of the vibrational modes of a carbon nanotube are weakly coupled to their environment; by contrast, the thermal coupling of metal nanoparticles to surrounding water is surprisingly efficient.

Cite this work

Researchers should cite this work as follows:

  • David Cahill (2005), "Thermal Conductance of solid-Solid and Solid-Liquid Interfaces,"

    BibTex | EndNote



Burton Morgan Entrepreneurship Center, Room 121

Tags, a resource for nanoscience and nanotechnology, is supported by the National Science Foundation and other funding agencies. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.