Thermal Microsystems for On-Chip Thermal Engineering
Electro-thermal co-design at the micro- and nano-scales is critical for achieving desired performance and reliability in microelectronic circuits. Emerging thermal microsystems technologies for this application area are discussed, with …
| Abstract | Electro-thermal co-design at the micro- and nano-scales is critical for achieving desired performance and reliability in microelectronic circuits. Emerging thermal microsystems technologies for this application area are discussed, with specific examples including a novel micromechanical electro-hydrodynamic micropump, electrowetting for fluidic actuation and site-specific thermal control, ion-driven airflow, and miniature piezoelectrically actuated cantilevers for cooling and sensing. Fundamental research into enabling technologies for such microsystems, conducted by the speaker’s group under the framework of the National Science Foundation Compact, High-Performance Cooling Technologies Research Center, is presented. note: There is some audio noise slides 6 through 10. |
|---|---|
| Bio |
|
| Sponsored by | NCN@Purdue Student Leadership Team |
| Cite this work | Researchers should cite this work as follows: |
| Time | 01:30 PM, March 21, 2006 |
| Location | EE Building, Room 118 |
| Tags |
Suresh Garimella is a Professor of Mechanical Engineering at Purdue University. He
received his PhD from the University of California at Berkeley in 1989. He is Director of
the NSF