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Interface structure and surface morphology of (Co, Fe, Ni)/Cu/Si(100) thin films

By Brian Demczyk

SynMat

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Abstract

We have examined bilayer Co/Cu, Fe/Cu, and Ni/Cu films deposited by molecular-beam epitaxy on
hydrogen-terminated @100# silicon substrates.

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Coauthors: V.M. Naik, A. Lukaszew, R. Naik, G. W. Auner

Cite this work

Researchers should cite this work as follows:

  • Brian Demczyk (2011), "Interface structure and surface morphology of (Co, Fe, Ni)/Cu/Si(100) thin films," https://nanohub.org/resources/12237.

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