The current state-of-the-art for large-scale InP photonic integrated circuits (PICs) is reviewed with a focus on the devices and technologies that are driving the commercial scaling of these highly integrated devices. Specifically, high-capacity dense wavelength division multiplexed (DWDM) transmitter and receiver photonic integrated circuits (PICs) are reviewed with a focus on next generation devices: >500 Gb/s and 1 Tb/s coherent multi-channel transmitter and receiver InP PICs. These large-scale PICs integrate hundreds of devices onto a single monolithic InP chip and enable significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption which enable benefits at the component and system level.
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MNTL 1000, University of Illinois, Urbana, IL
University of Illinois at Urbana-Champaign
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