The current state-of-the-art for large-scale InP photonic integrated circuits (PICs) is reviewed with a focus on the devices and technologies that are driving the commercial scaling of these highly integrated devices. Specifically, high-capacity dense wavelength division multiplexed (DWDM) transmitter and receiver photonic integrated circuits (PICs) are reviewed with a focus on next generation devices: >500 Gb/s and 1 Tb/s coherent multi-channel transmitter and receiver InP PICs. These large-scale PICs integrate hundreds of devices onto a single monolithic InP chip and enable significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption which enable benefits at the component and system level.

Javid Mohammed Ali

University of Illinois at Urbana-Champaign

Dr. Kish is a Fellow of the Optical Society of America (OSA) and Institute of Electrical and Electronics Engineers (IEEE). His awards include the IEEE David Sarnoff Award, the IEEE LEOS Engineering Achievement Award, the OSA Adolph Lomb Award, the International Symposium on Compound Semiconductors Young Scientist Award, and the Young Alumni Achievement Award, R.T. Chien Award, and the E.C. Jordan Award from the University of Illinois ECE Department.He has co-authoredover 100 U.S. Patents and over 60 peer-reviewed publications.

Researchers should cite this work as follows:

• Frederick A. Kish, Jr.; Javid Mohammed Ali (2011), "Illinois Nano EP Seminar Series Fall 2011: Current Status of Coherent Large-Scale InP Photonic Integrated Circuits," https://nanohub.org/resources/12372.

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