The current state-of-the-art for large-scale lnP photonic integrated circuits (PICs) is reviewed with a focus on the devices and technologies that are driving the commercial scaling of these highly integrated devices. Specifically, high-capacity dense wavelength division multiplexed (DWDM) transmitter and receiver photonic integrated circuits (PICs) are reviewed with a focus on next generation devices: >500 Gb/s and 1 Tb/s coherent multi-channel transmitter and receiver lnP PICs. These large-scale PICs integrate hundreds of devices onto a single monolithic lnP chip and enable significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption which enable benefits at the component and system level.
Frederick A. Kish, Jr., Ph.D. is Vice President, PIC Development and Manufacturing for Infinera Corporation. From November 1999 to May 2001, Dr. Kish served as R&D and Manufacturing Development Manager for the Fiber Optics Communications Division of Agilent Technologies, Inc. Dr. Kish holds B.S., M.S. and Ph.D. degrees in electrical engineering from the University of Illinois at Urbana-Champaign.
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MNTL 1000, University of Illinois at Urbana-Champagn, Urbana, IL