Combined Microstructure and Heat Transfer Modeling of Carbon Nanotube Thermal Interface Materials

By Yide Wang1, Sridhar Sadasivam1, Timothy S Fisher1

1. Purdue University

Simulate mechanical and thermal performance of CNT thermal interface materials.

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Version 1.0 - published on 14 Apr 2015

doi:10.4231/D3SN0152F cite this

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Usage

World usage

Location of all "Combined Microstructure and Heat Transfer Modeling of Carbon Nanotube Thermal Interface Materials" Users Since Its Posting

Simulation Users

191

9 12 12 15 16 25 27 29 39 41 46 56 60 62 65 68 72 74 78 80 89 93 94 96 105 107 109 113 117 121 123 133 139 143 148 151 155 157 159 164 166 169 174 177 185 186 188 190 191

Users By Organization Type
Type Users
Unidentified 159 (83.25%)
Educational - University 31 (16.23%)
Industry 1 (0.52%)
Users by Country of Residence
Country Users
in INDIA 12 (38.71%)
us UNITED STATES 9 (29.03%)
de GERMANY 2 (6.45%)
ru RUSSIAN FEDERATION 2 (6.45%)
cn CHINA 2 (6.45%)
tr TURKEY 1 (3.23%)
bd BANGLADESH 1 (3.23%)
dz ALGERIA 1 (3.23%)
ng NIGERIA 1 (3.23%)

Simulation Runs

1,318

28 42 43 54 55 89 94 99 126 146 156 249 422 695 715 727 736 769 782 794 806 821 849 860 943 947 959 969 981 990 999 1018 1037 1048 1077 1101 1141 1151 1161 1186 1193 1217 1245 1268 1294 1301 1307 1314 1318
Overview
Average Total
Wall Clock Time 8.86 hours 300.07 days
CPU time 5.05 hours 170.96 days
Interaction Time 12.64 minutes 7.14 days