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Carbon Nanotubes Interconnect Analyzer (CNIA)

By Sansiri Tanachutiwat1, wei wang2

1. College of Nanoscale Science and Engineering, University at Albany, Albany, NY, USA 2. CNSE, University at Albany

Analyze performances of carbon nanotube bundle interconnects

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Archive Version 1.1.1
Published on 19 Oct 2009, unpublished on 19 Oct 2009
Latest version: 1.1.2. All versions

doi:10.4231/D3GF0MW1J cite this

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Abstract

This tool estimates the conductance and inductance of carbon nanotube bundles for interconnect applications. The analysis is based on the bundle structure of a mixture of multi-wall and single-wall carbon nanotubes, which is a realistic structure and significantly different from other theoretical results.

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