Carbon Nanotubes Interconnect Analyzer (CNIA)

Analyze performances of carbon nanotube bundle interconnects

Launch Tool

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Archive Version 1.1.2
Published on 19 Oct 2009 All versions

doi:10.4231/D38S4JP0N cite this

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Abstract

This tool estimates the conductance and inductance of carbon nanotube bundles for interconnect applications. The analysis is based on the bundle structure of a mixture of multi-wall and single-wall carbon nanotubes, which is a realistic structure and significantly different from other theoretical results.

Credits

The tool was developed by the nanoelectronic research group led by Dr. Wei Wang, College of Nanoscale Science and Engineering, University at Albany.

References

Cite this work

Researchers should cite this work as follows:

  • "Analyzing conductance of carbon nanotube bundles," IEEE Electronic Device Letters, (2007).
  • "Liwei Shang, Ming Liu, Sansiri Tanachutiwat and Wei Wang, “Diameter-dependant thermal conductance models of carbon nanotubes,” International Journal of NanoParticles, CNT special issue,(2007).
  • "Liwei Shang, Ming Liu, Sansiri Haruehanroengra, and Wei Wang, “Inductance of mixed carbon nanotube bundles,” IEE Micro and Nano Letters, vol. 2, no. 2, pp. 35-39, June 2007.

  • Sansiri Tanachutiwat, Wei Wang (2018), "Carbon Nanotubes Interconnect Analyzer (CNIA)," https://nanohub.org/resources/cnia. (DOI: 10.4231/D38S4JP0N).

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Tags

  1. carbon nanotubes
  2. characterization
  3. nanoelectronics