Support Options

Submit a Support Ticket

Home Tools Carbon Nanotubes Interconnect Analyzer (CNIA) About

Carbon Nanotubes Interconnect Analyzer (CNIA)

By Sansiri Tanachutiwat1, wei wang2

1. College of Nanoscale Science and Engineering, University at Albany, Albany, NY, USA 2. CNSE, University at Albany

Analyze performances of carbon nanotube bundle interconnects

Launch Tool

You must login before you can run this tool.

Version 1.1.2w - published on 17 Mar 2015

doi:10.4231/D3HM52K9P cite this

This tool is closed source.

View All Supporting Documents




Published on


This tool estimates the conductance and inductance of carbon nanotube bundles for interconnect applications. The analysis is based on the bundle structure of a mixture of multi-wall and single-wall carbon nanotubes, which is a realistic structure and significantly different from other theoretical results.


The tool was developed by the nanoelectronic research group led by Dr. Wei Wang, College of Nanoscale Science and Engineering, University at Albany.


Cite this work

Researchers should cite this work as follows:

  • "Analyzing conductance of carbon nanotube bundles," IEEE Electronic Device Letters, (2007).
  • "Liwei Shang, Ming Liu, Sansiri Tanachutiwat and Wei Wang, “Diameter-dependant thermal conductance models of carbon nanotubes,” International Journal of NanoParticles, CNT special issue,(2007).
  • "Liwei Shang, Ming Liu, Sansiri Haruehanroengra, and Wei Wang, “Inductance of mixed carbon nanotube bundles,” IEE Micro and Nano Letters, vol. 2, no. 2, pp. 35-39, June 2007.
  • Sansiri Tanachutiwat; wei wang (2015), "Carbon Nanotubes Interconnect Analyzer (CNIA)," (DOI: 10.4231/D3HM52K9P).

    BibTex | EndNote

Tags, a resource for nanoscience and nanotechnology, is supported by the National Science Foundation and other funding agencies. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.