A Pursuit of Geometry-Centric Solutions to Engineering Problems

By Ganesh Subbarayan

Mechanical Engineering, Purdue University, West Lafayette, IN

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Abstract

Engineers often face the need to analyze challenging multi-physics problems driven by mechanical forces, heat, as well as phenomena such as diffusion. These forces commonly cause parts to deform, cracks to grow or material phases to evolve. The evolution of cracks or phase boundaries in turn has consequences for product performance that the engineers seek to optimize. In a purely design context, the boundary shape may be evolved deliberately by the engineers to optimally achieve the design goals. The main thesis of this talk is that a geometry-centric viewpoint during analysis of behavior is not only necessary to ensure the accuracy of the predicted shapes of boundaries and interfaces, but also enables efficient solution. Furthermore, I will demonstrate that an explicit parametric representation of the boundaries is feasible even in complex problems such as dendritic solidification. Since it is my firm belief that engineering research must be in service of a need to solve (messy) engineering problems, I will intersperse the description of techniques with solutions to several practical problems drawn from the electronics industry.

Bio

Ganesh Subbarayan Ganesh Subbarayan is a Professor of Mechanical Engineering. He began his professional career at IBM Corporation (1990-1993). He holds a B.Tech degree in Mechanical Engineering (1985) from the Indian Institute of Technology, Madras and his M.S. (1989) and Ph. D. (1991) degrees in Mechanical Engineering from Cornell University. Dr. Subbarayan's core research is broadly concerned with developing computational techniques to seamlessly integrate CAD with CAE while practical aspects of his research are to model and experimentally characterize failure in microelectronic devices and assemblies. He was a pioneer in using geometric models directly for analysis, popularly referred to as Isogeometric Analysis. As an independent consultant, he contributed to ensuring reliable designs of Microsoft Kinect and Surface line of products. Among others, Dr. Subbarayan is a recipient of the 2005 Mechanics Award from the ASME EPP Division and the NSF CAREER award. He is a Fellow of ASME as well as IEEE, and he served as the Editor-in-Chief of IEEE Transactions on Advanced Packaging during 2002-2010. He also served as the topical editor for John Wiley’s Encyclopedia of Electrical and Electronics Engineering during 2011-2012.

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Researchers should cite this work as follows:

  • Ganesh Subbarayan (2017), "A Pursuit of Geometry-Centric Solutions to Engineering Problems," http://nanohub.org/resources/26241.

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ME 2054, Purdue University, West Lafayette, IN

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A Pursuit of Geometry-Centric Solutions to Engineering Problems
  • A Pursuit of Geometry-Centric Solutions to Engineering Problems 1. A Pursuit of Geometry-Centric … 0
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  • Early Education 2. Early Education 60.593927260593929
    00:00/00:00
  • Graduate Education (Cornell University, 1985-90) 3. Graduate Education (Cornell Un… 140.54054054054055
    00:00/00:00
  • A Variational, Multi-Objective, Model for Bones 4. A Variational, Multi-Objective… 321.95528862195528
    00:00/00:00
  • Variational Sensitivity Analysis 5. Variational Sensitivity Analys… 602.635969302636
    00:00/00:00
  • First Professional Experience (IBM Corporation, 1990-93) 6. First Professional Experience … 741.54154154154162
    00:00/00:00
  • First Academic Job (U. Colorado at Boulder, 1994-2002) 7. First Academic Job (U. Colorad… 940.940940940941
    00:00/00:00
  • Ph.D. Advisees 8. Ph.D. Advisees 998.89889889889889
    00:00/00:00
  • Ph.D. Advisees 9. Ph.D. Advisees 1050.7841174507842
    00:00/00:00
  • M.S. Advisees 10. M.S. Advisees 1086.8535201868535
    00:00/00:00
  • Co-Advisors 11. Co-Advisors 1096.0627293960629
    00:00/00:00
  • Printer Color Modeling 12. Printer Color Modeling 1107.0070070070071
    00:00/00:00
  • Printer Color Management 13. Printer Color Management 1120.387053720387
    00:00/00:00
  • Printer Gamut Mapping Problem 14. Printer Gamut Mapping Problem 1181.3813813813815
    00:00/00:00
  • Gamut Mapping and GCR 15. Gamut Mapping and GCR 1244.1775108441775
    00:00/00:00
  • Color Error vs. Ink Usage 16. Color Error vs. Ink Usage 1320.2535869202536
    00:00/00:00
  • Career at Purdue (2002-) 17. Career at Purdue (2002-) 1383.1831831831833
    00:00/00:00
  • New Professional Service Role (EiC, IEEE Transactions on Advanced Packaging, 2002-10) 18. New Professional Service Role … 1400.8008008008007
    00:00/00:00
  • CAD-CAE Integration 19. CAD-CAE Integration 1440.9743076409743
    00:00/00:00
  • Motivation: Complex Droplet Shapes 20. Motivation: Complex Droplet Sh… 1454.4210877544213
    00:00/00:00
  • Geometry Modeling in Shape Optimization A few Geometry Based Approaches in Literature 21. Geometry Modeling in Shape Opt… 1625.5922589255924
    00:00/00:00
  • Motivation: Smooth Geometry, NURBS 22. Motivation: Smooth Geometry, N… 1659.3593593593594
    00:00/00:00
  • Parametric Curves in Geometry Modeling 23. Parametric Curves in Geometry … 1692.625959292626
    00:00/00:00
  • Isogeometric Analysis 24. Isogeometric Analysis 1708.3750417083752
    00:00/00:00
  • CSG vs B-rep CAD Models 25. CSG vs B-rep CAD Models 1733.2999666333
    00:00/00:00
  • Hierarchically Constructed Functional Approximations (on CSG Models) 26. Hierarchically Constructed Fun… 1806.4397731064398
    00:00/00:00
  • Application: HiGeom – A System for Symbolic CAD on Trivariate Solids 27. Application: HiGeom – A Syst… 1873.2732732732734
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  • Application: Shape Optimization 28. Application: Shape Optimizatio… 1948.5151818485153
    00:00/00:00
  • Simultaneous Shape and Material Distribution Design 29. Simultaneous Shape and Materia… 1999.0657323990658
    00:00/00:00
  • Application: Particulate Thermal Interface Materials 30. Application: Particulate Therm… 2108.0080080080079
    00:00/00:00
  • Analytical Predictions at High Loadings 31. Analytical Predictions at High… 2175.0750750750753
    00:00/00:00
  • Effective Conductivity of Thermal Interface Materials 32. Effective Conductivity of Ther… 2227.1604938271607
    00:00/00:00
  • NEMD for Size-Dependent Thermal Conductivity Estimation 33. NEMD for Size-Dependent Therma… 2283.14981648315
    00:00/00:00
  • Evolving Boundaries with Explicit Parametric Geometry 34. Evolving Boundaries with Expli… 2309.2759426092762
    00:00/00:00
  • Examples of Problems with Evolving Boundaries 35. Examples of Problems with Evol… 2315.5488822155489
    00:00/00:00
  • Analyzing B-Rep Models 36. Analyzing B-Rep Models 2357.2906239572908
    00:00/00:00
  • Implicit or Explicit Boundary? 37. Implicit or Explicit Boundary? 2395.7624290957624
    00:00/00:00
  • Explicit, Immersed Boundary – CAD Issues 38. Explicit, Immersed Boundary … 2474.4744744744744
    00:00/00:00
  • Exact or Linearized Geometry? 39. Exact or Linearized Geometry? 2524.3576910243578
    00:00/00:00
  • Overview of Algebraic Distance Field Construction for a Bezier Curve 40. Overview of Algebraic Distance… 2583.8171504838174
    00:00/00:00
  • Examples – NURBS Curves 41. Examples – NURBS Curves 2601.5015015015015
    00:00/00:00
  • Examples – NURBS Surfaces 42. Examples – NURBS Surfaces 2608.8088088088089
    00:00/00:00
  • Application: Stefan Problem 43. Application: Stefan Problem 2630.930930930931
    00:00/00:00
  • An Explicit Interface Approach 44. An Explicit Interface Approach 2633.7671004337672
    00:00/00:00
  • Examples – Steady-state Dendritic Solidification 45. Examples – Steady-state Dend… 2659.6930263596932
    00:00/00:00
  • A Geometric View of a Crack 46. A Geometric View of a Crack 2705.1384718051386
    00:00/00:00
  • Enriched Isogeometric Analysis of Cracks 47. Enriched Isogeometric Analysis… 2809.743076409743
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  • Examples – Quasi-static crack propagation 48. Examples – Quasi-static crac… 2823.8905572238905
    00:00/00:00
  • Simulations of Crack Deflection 49. Simulations of Crack Deflectio… 2850.7173840507176
    00:00/00:00
  • Stress Singularities at Multi-Material Corners 50. Stress Singularities at Multi-… 2912.8461795128464
    00:00/00:00
  • Asymptotic Analysis Procedure 51. Asymptotic Analysis Procedure 2973.406740073407
    00:00/00:00
  • Application: Risk Sites in ILD Stack 52. Application: Risk Sites in ILD… 2982.6159492826159
    00:00/00:00
  • Critical Material Junctions Based On Strength of Singularity 53. Critical Material Junctions Ba… 3013.1464798131465
    00:00/00:00
  • Application: Analysis of Chip-Package Interaction 54. Application: Analysis of Chip-… 3056.5231898565235
    00:00/00:00
  • Damage on Cooling from ILD Deposition and Heating to Reflow Temperature (400oC to 25oC to 220oC) 55. Damage on Cooling from ILD Dep… 3074.1741741741744
    00:00/00:00
  • Damage on Cooling from Reflow to Room Temperature (220oC to 25o C) 56. Damage on Cooling from Reflow … 3121.8885552218885
    00:00/00:00
  • Configurational Optimization 57. Configurational Optimization 3140.373707040374
    00:00/00:00
  • Configurational Optimization Problem 58. Configurational Optimization P… 3144.1107774441107
    00:00/00:00
  • Configurational Derivative 59. Configurational Derivative 3218.8855522188856
    00:00/00:00
  • Translation, Rotation and Scaling Sensitivities 60. Translation, Rotation and Scal… 3254.4878211544878
    00:00/00:00
  • Examples – Optimal Location of A Circular Hole 61. Examples – Optimal Location … 3285.9859859859862
    00:00/00:00
  • Examples – Optimal Location of a Heterogeneity in the Presence of a Crack 62. Examples – Optimal Location … 3310.343677010344
    00:00/00:00
  • Examples – Optimal Location of a Heterogeneity in the Presence of a Crack (cont'd) 63. Examples – Optimal Location … 3318.8188188188187
    00:00/00:00
  • Examples – Simultaneous Optimization of Location and Orientation of an Ellipsoidal Hole 64. Examples – Simultaneous Opti… 3334.4678011344681
    00:00/00:00
  • Buckling Induced Debond in Thin Films 65. Buckling Induced Debond in Thi… 3338.6720053386721
    00:00/00:00
  • Buckling-Induced Debond in Compressed Thin Films 66. Buckling-Induced Debond in Com… 3355.9225892559225
    00:00/00:00
  • Test Specimen and Methodology 67. Test Specimen and Methodology 3394.6279612946282
    00:00/00:00
  • Fracture Toughness - Elastic Analysis 68. Fracture Toughness - Elastic A… 3397.1304637971307
    00:00/00:00
  • Fracture Toughness – Elastic-Plastic Analysis 69. Fracture Toughness – Elastic… 3414.2809476142811
    00:00/00:00
  • Dynamics and Stability of Diffusive Reactive Interfaces 70. Dynamics and Stability of Diff… 3422.188855522189
    00:00/00:00
  • Reaction and Interfacial Growth in SnAg Solder Joints 71. Reaction and Interfacial Growt… 3430.9642976309642
    00:00/00:00
  • Model for IMC Growth 72. Model for IMC Growth 3462.1621621621621
    00:00/00:00
  • Bulk Diffusion 73. Bulk Diffusion 3494.6613279946614
    00:00/00:00
  • Simulation of Growth without External Fields 74. Simulation of Growth without E… 3507.4074074074074
    00:00/00:00
  • Stability of the Interface 75. Stability of the Interface 3517.5508842175509
    00:00/00:00
  • Evolution of Rough Interface 76. Evolution of Rough Interface 3543.61027694361
    00:00/00:00
  • Damage Accumulation and Fatigue Fracture in Ductile Alloys 77. Damage Accumulation and Fatigu… 3558.8588588588591
    00:00/00:00
  • Hybrid Fracture-Damage Model 78. Hybrid Fracture-Damage Model 3561.3279946613279
    00:00/00:00
  • Hierarchy in Fracture Processes 79. Hierarchy in Fracture Processe… 3677.2105438772105
    00:00/00:00
  • Theory: Information Hierarchy 80. Theory: Information Hierarchy 3680.4137470804139
    00:00/00:00
  • Theory: Maximum Entropy Principle 81. Theory: Maximum Entropy Princi… 3683.5168501835169
    00:00/00:00
  • Theory: Damage Measure 82. Theory: Damage Measure 3685.8525191858525
    00:00/00:00
  • Custom-Built Microscale Mechanical Tester 83. Custom-Built Microscale Mechan… 3693.9606272939609
    00:00/00:00
  • Isothermal Lap Shear Fatigue Tests on Sn3.8Ag0.7Cu Solder Joints 84. Isothermal Lap Shear Fatigue T… 3720.7540874207543
    00:00/00:00
  • Damage model 85. Damage model 3723.5902569235905
    00:00/00:00
  • Prediction at 125 C based on 25 C 86. Prediction at 125 C based on 2… 3744.3109776443112
    00:00/00:00
  • Experimental Characterization of Fatigue Fracture in WLCSP Solder Joints 87. Experimental Characterization … 3763.3967300633967
    00:00/00:00
  • Crack Growth of Corner Joint 88. Crack Growth of Corner Joint 3773.23990657324
    00:00/00:00
  • Simulated Fracture at 4747 Cycles 89. Simulated Fracture at 4747 Cyc… 3782.0487153820491
    00:00/00:00
  • Comparison between Experimental and Simulated Crack Lengths 90. Comparison between Experimenta… 3786.052719386053
    00:00/00:00
  • Simulation vs. Experimental 91. Simulation vs. Experimental 3787.9212545879213
    00:00/00:00
  • Comparison to Observed Trajectories 92. Comparison to Observed Traject… 3793.5935935935936
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  • Summary 93. Summary 3795.2952952952955
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