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Modeling and Analysis of VLSI Interconnects

By Cheng-Kok Koh

Electrical and Computer Engineering, Purdue University, West Lafayette, IN

Published on


With continual technology scaling, the accurate and efficient modeling and simulation of interconnect effects have become problems of central importance. In order to accurately model the distributive effects of interconnects, it is necessary to divide a long wire into several segments, with each regarded as a lumped RLC element. In this tutorial, two fundamental problems in the modeling and analysis of VLSI interconnects will be covered: (i) capacitance extraction and (ii) simulation of interconnects with inductive coupling.

For capacitance extraction, one approach is to use a boundary element technique for solving the integral form of Laplace equations. Such an approach usually involves an iterative solver whose most expensive operation is matrix-vector multiply. The tutorial will include a fast multi-pole method that relies on a hierarchical data structure to perform matrix-vector multiply in linear time complexity.

The second part of the tutorial will introduce a fast simulation technique for inductively coupled interconnects based on the notion of wire-duplication. The technique exploits the sparsity resident in the inverse of a inductance matrix to construct a small-sized equivalent RLC circuit. The wire-duplication technique improves simulation efficiency significantly while preserving simulation accuracy.


Cheng-Kok Koh Prof. Koh received the Ph.D. degree in computer science from University of California at Los Angeles. Currently, he is an Associate Professor of Electrical and Computer Engineering at Purdue University, West Lafayette, Indiana. His research interests include physical design of high-performance low-power VLSI circuits, with an emphasis on VLSI interconnect layout optimization. He received the ACM Special Interest Group on Design Automation (SIGDA) Meritorious Service Award in 1998 and the SIGDA Distinguished Service Award in 2002, the National Science Foundation CAREER Award in 2000, and the Semiconductor Research Corporation Inventor Recognition Award in 2005.

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  • Cheng-Kok Koh (2007), "Modeling and Analysis of VLSI Interconnects,"

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