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New Dimension in Performance: Harnessing 3D Integration Technology

By Kerry Bernstein

IBM T.J. Watson Research Center

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    James Bowery

    2.0 out of 5 stars

    There is a slide missing from the presentation. Unfortunately, it is the most important slide of all: LATENCY pico sec | Technology X | Intra-chip Y | TCV Z | Off-chip (pins)

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