Electronics from the Bottom Up - an innovative educational initiative co-sponsored by Intel, NCN, and Purdue University - introduces students to a new way of thinking about the opportunities and fundamental limits of nanoscale electronics - from mainstream CMOS to emerging devices. This new approach prepares students broadly to realize the potential of emerging nanoscale devices for the electronics switching, flexible electronics, energy conversion, and biosensing.

The 2009 Summer School focuses on percolative transport and reliability in nanostructured electronic devices with additional sessions on graphene electronics. The format will be:

Mornings: Nanostructured Electronic Devices: Percolation and Reliability, by Muhammad A. Alam

Afternoons: Colloquium on Graphene Physics and Devices by Supriyo Datta, Mark S. Lundstrom and Joerg Appenzeller

Participants who complete the series of lectures and exercises will be awarded a certificate of completion.

For more information on the “Electronics from the Bottom Up” initiative, see: nanoHUB.org: Electronics from the Bottom Up.

“Electronics from the Bottom Up” is an educational initiative designed to bring a new perspective to the field of nano device engineering. It is co-sponsored by the Intel Foundation and the Network for Computational Nanotechnology.

Researchers should cite this work as follows:

• Supriyo Datta, Mark Lundstrom, Muhammad A. Alam, Joerg Appenzeller (2009), "2009 NCN@Purdue Summer School: Electronics from the Bottom Up," https://nanohub.org/resources/7113.

  BibTex | EndNote

1. bottom up approach
2. device physics
3. devices
4. graphene
5. nanoelectronics
6. NEGF
7. percolation
8. reliability
9. Summer School