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Carbon Nanotubes Interconnect Analyzer (CNIA)

1. College of Nanoscale Science and Engineering, University at Albany, Albany, NY, USA 2. CNSE, University at Albany

Analyze performances of carbon nanotube bundle interconnects

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Version 1.1.2 - published on 19 Oct 2009

DOI: 10254/nanohub-r2464.4 cite this

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Category	Tools
Abstract	This tool estimates the conductance and inductance of carbon nanotube bundles for interconnect applications. The analysis is based on the bundle structure of a mixture of multi-wall and single-wall carbon nanotubes, which is a realistic structure and significantly different from other theoretical results.
Credits	The tool was developed by the nanoelectronic research group led by Dr. Wei Wang, College of Nanoscale Science and Engineering, University at Albany.
References	Wei Wang's home page
Cite this work	Researchers should cite this work as follows: "Analyzing conductance of carbon nanotube bundles," IEEE Electronic Device Letters, (2007). "Liwei Shang, Ming Liu, Sansiri Tanachutiwat and Wei Wang, “Diameter-dependant thermal conductance models of carbon nanotubes,” International Journal of NanoParticles, CNT special issue,(2007). "Liwei Shang, Ming Liu, Sansiri Haruehanroengra, and Wei Wang, “Inductance of mixed carbon nanotube bundles,” IEE Micro and Nano Letters, vol. 2, no. 2, pp. 35-39, June 2007. Sansiri Tanachutiwat; Wei Wang (2009), "Carbon Nanotubes Interconnect Analyzer (CNIA)," DOI: 10254/nanohub-r2464.4. (DOI: 10254/nanohub-r2464.4). BibTex \| EndNote
Tags	carbon nanotubes characterization nanoelectronics