Thin-Film and Multi-Element Thermoelectric Devices Simulator

By Je-Hyeong Bahk1, Megan Youngs1, Zach Schaffter1, Kazuaki Yazawa, Ali Shakouri1

1. Purdue University

Tool to simulate both micro-scale thin-film thermoelectric devices and large-scale multi-element thermoelectric modules for cooling and power generation

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Version 2.1 - published on 14 Aug 2014

doi:10.4231/D33T9D71B cite this

This tool is closed source.

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Usage

World usage

Location of all "Thin-Film and Multi-Element Thermoelectric Devices Simulator" Users Since Its Posting

Simulation Users

380

6 23 27 31 47 115 118 122 142 151 163 170 175 183 188 193 208 212 218 222 229 236 248 266 268 275 283 294 301 306 315 323 355 366 380 380

Users By Organization Type
Type Users
Unidentified 238 (62.47%)
Educational - University 125 (32.81%)
Industry 8 (2.1%)
National Lab 6 (1.57%)
Unemployed 2 (0.52%)
Educational - Pre-College 1 (0.26%)
Military 1 (0.26%)
Users by Country of Residence
Country Users
us UNITED STATES 61 (54.46%)
in INDIA 17 (15.18%)
de GERMANY 5 (4.46%)
se SWEDEN 5 (4.46%)
kr KOREA, REPUBLIC OF 5 (4.46%)
es SPAIN 5 (4.46%)
ca CANADA 4 (3.57%)
bd BANGLADESH 4 (3.57%)
tr TURKEY 4 (3.57%)
co COLOMBIA 2 (1.79%)

Simulation Runs

3,866

59 160 195 206 435 1527 1579 1601 1892 1956 1993 2038 2071 2121 2191 2218 2266 2280 2307 2220 2256 2287 2356 2575 2578 2597 2610 2642 2664 2677 2699 2740 3323 3659 3866 3866
Overview
Average Total
Wall Clock Time 2.43 hours 259.46 days
CPU time 6.64 seconds 4.73 hours
Interaction Time 43.46 minutes 77.38 days