Thin-Film and Multi-Element Thermoelectric Devices Simulator

By Je-Hyeong Bahk1, Megan Youngs1, Zach Schaffter1, Kazuaki Yazawa, Ali Shakouri1

1. Purdue University

Tool to simulate both micro-scale thin-film thermoelectric devices and large-scale multi-element thermoelectric modules for cooling and power generation

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Version 2.1 - published on 14 Aug 2014

doi:10.4231/D33T9D71B cite this

This tool is closed source.

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Usage

World usage

Location of all "Thin-Film and Multi-Element Thermoelectric Devices Simulator" Users Since Its Posting

Simulation Users

430

6 23 27 28 44 113 116 120 140 149 161 168 173 181 186 191 206 210 216 222 229 236 248 266 268 275 283 294 301 306 315 323 355 366 380 388 398 406 408 430

Users By Organization Type
Type Users
Unidentified 282 (65.43%)
Educational - University 129 (29.93%)
Industry 9 (2.09%)
National Lab 7 (1.62%)
Unemployed 2 (0.46%)
Military 1 (0.23%)
Educational - Pre-College 1 (0.23%)
Users by Country of Residence
Country Users
us UNITED STATES 63 (54.31%)
in INDIA 19 (16.38%)
de GERMANY 5 (4.31%)
se SWEDEN 5 (4.31%)
kr KOREA, REPUBLIC OF 5 (4.31%)
es SPAIN 5 (4.31%)
tr TURKEY 4 (3.45%)
ca CANADA 4 (3.45%)
bd BANGLADESH 4 (3.45%)
ru RUSSIAN FEDERATION 2 (1.72%)

Simulation Runs

4,174

59 160 195 151 320 1412 1464 1486 1777 1841 1878 1923 1956 2006 2073 2100 2148 2162 2189 2220 2256 2287 2356 2575 2578 2597 2610 2642 2664 2677 2699 2740 3323 3659 3866 3922 3967 3990 4005 4174
Overview
Average Total
Wall Clock Time 2.3 hours 266.26 days
CPU time 6.42 seconds 4.95 hours
Interaction Time 41.71 minutes 80.49 days