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Berkeley VCSEL Compact Model
28 May 2015 | Compact Models | Contributor(s):
By Adair Gerke1, Connie J. Chang-Hasnain1
University of California, Berkeley
The U.C. Berkeley Vertical Cavity Surface Emitting Laser (VCSEL) Compact Model provides a circuit simulator compatible Verilog-A model of VCSEL lasers, primarily for use in designing...
CNRS - Carbon Nanotube Interconnect RC Model
06 Oct 2017 | Compact Models | Contributor(s):
By Jie LIANG, Aida Todri1
A carbon nanotube interconnect compact model is developed with fundamental physics understanding and electrical modeling. Single Wall Carbon Nanotube (SWCNT) RC electrical model takes into...
Emerging CMOS Technology at 5 nm and Beyond: Emerging Interconnect Technologies
14 Dec 2015 | Presentation Materials | Contributor(s): Krishna Saraswat
Emerging Interconnect Technologies
13 Jun 2008 | Tools | Contributor(s): Sansiri Tanachutiwat, Wei Wang, Nicholas Anthony Connelly
Estimate performances of graphene interconnects
Graphene Switch Box
10 Aug 2010 | Tools | Contributor(s): Sansiri Tanachutiwat, wei wang
Graphene Switch Box for FPGA Interconnects
SPICE Subcircuit Generator for Spintronic Nonmagnetic Metallic Channel Components
11 Oct 2017 | Tools | Contributor(s): Onur Dincer, Azad Naeemi
Generates SPICE subcircuit netlist for electronic and spintronic transport in nanoscale nonmagnetic metallic channels
Spin Transport Modeling Tool
25 Aug 2017 | Tools | Contributor(s): Onur Dincer, Azad Naeemi
Calculates spin transport parameters in nanoscale metallic interconnects.
UCSB Graphene Nanoribbon Interconnect Compact Model
21 Apr 2015 | Compact Models | Contributor(s):
By Junkai Jiang1, Wei Cao1, Kaustav Banerjee1
University of California Santa Barbara
UCSB GNR interconnect model is based on a distributed RLC circuit, in which carrier mean free path, graphene doping concentration (Fermi level) and number of layers are considered. The model was...
20 Apr 2017 | Compact Models | Contributor(s):
By Junkai Jiang1, Kaustav Banerjee1, Wei Cao2
1. University of California, Santa Barbara 2. University of California Santa Barbara
As the (local) interconnect dimension scales down to sub-20 nm, the rapidly increasing metal resistance by barrier layer and surface and grain boundary scatterings, and the diminishing current...