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Trip to Argonne, Spring 2009

by Amritanshu Palaria, Nicholas Vargo, Ahmad Ehteshamul Islam, raseong kim, Fengyuan Li, Himadri Pal

Version 8
by Amritanshu Palaria
Version 9
by Amritanshu Palaria

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1 NCN@Purdue SLC is organizing a trip to [ Argonne National Lab] in Chicago this Spring. The trip shall tentatively take place on Monday, May 11, 2009. The trip is free for NCN affiliated students at Purdue. All transportation and lunch expenses shall be paid by the NCN. We will board the bus on Purdue campus in the morning and return before night the same day. Argonne shall provide us a tour of their facilities. This trip includes a tour of the following facilities:[[br]]
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For information on the various research divisions of Argonne please check:[ Argonne divisions]. If you want to visit, '''it is important that you vote''' your interest at [ this poll].
[ Center for Nanoscale Materials]
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[ Advanced Photon Source]
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[ Argonne Leadership Computing Facility]
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For information on the various research divisions of Argonne please check:[ Argonne divisions].
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This page will be updated with the trip information.
If you will visit with us, it is important that you '''accept the invitation by participating in the following poll''':
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Special Instructions: TBA
'''''Special Instructions''''': If you are an international student, fill out the premises access form and provide a copy of your passport, visa, and I-20 to one of the SLC members by EOB __'''April 22, 2009'''__. If you do not have the premises access form, send an email to
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Date: TBA
'''''Date''''': May 11, 2009 (Monday)
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Departure venue: TBA
'''''Departure venue''''': TBA
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Departure time: TBA
'''''Departure time''''': TBA
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Weather conditions: TBA
'''''Weather conditions''''': TBA, a resource for nanoscience and nanotechnology, is supported by the National Science Foundation and other funding agencies. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.