Courses

Introduction to Heterogeneous Integration and Electronics Packaging

This course provides a broad, hands-on introduction to principles and practices of electronics packaging. The course is broadly divided into four major modules as well as other smaller modules. The major modules provide a practical background (as it relates to electronic packaging) in electrical, thermal, mechanical and materials characterization. Design considerations as well as materials selection in the above topics will also be addressed. The minor modules include package fabrication and assembly, radiation hardening, and statistical modeling and data analysis. The class will be primarily lab-oriented with 1 lecture each week and 4 hours of hands-on lab.

  1. characterization
  2. design
  3. electronics packaging
  4. radiation hardening
EPHI

This course provides a broad, hands-on introduction to principles and practices of electronics packaging. The course is broadly divided into four major modules as well as other smaller modules. The major modules provide a practical background (as it relates to electronic packaging) in electrical, thermal, mechanical and materials characterization. Design considerations as well as materials selection in the above topics will also be addressed. The minor modules include package fabrication and assembly, radiation hardening, and statistical modeling and data analysis. The class will be primarily lab-oriented with 1 lecture each week and 4 hours of hands-on lab.

Topics

Prerequisites

Junior-Level standing in an ABET Accredited Undergraduate Engineering Program

Overview of Electronics Packaging and HI
Electrical Design and Characterization
Thermal Design and Characterization
Mechanical Design and Characterization
Material Selection and Characterization
Package Fabrication
Statistical Modelling and Data Analysis
Radiation Hardening