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Coral Name: DiscoDad
Process/Equipment Owner: Tim Miller
Max Wafer Size: 6
The Disco dicing saw is a precision sawing machine used in cutting semiconductor and MEMS wafers for separation of individual chips or devices.
Pieces to be cut are mounted on wafer tape, which allows any size and shape of sample to be cut, up to 6 inches in diameter, and up to 1 millimeter thick.
A supply of blades is on hand for most common substrates. Unusual substrates or non-standard cutting dimensions (i. e. extremely narrow kerf) may necessitate ordering special blades. There may be an extra cost to order special blades.
* Must install Coral and be a trained user to reserve a slot on this system.