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Disco DAD-2H/6 Dicing Saw

Equipment home > Back-End > Disco DAD-2H/6 Dicing Saw

General Information:

Coral Name: DiscoDad
FIC: Shared
Process/Equipment Owner: Tim Miller
Location: brk2261
Max Wafer Size: 6

System Information:

General Description:

The Disco dicing saw is a precision sawing machine used in cutting semiconductor and MEMS wafers for separation of individual chips or devices.

Capabilities:

Pieces to be cut are mounted on wafer tape, which allows any size and shape of sample to be cut, up to 6 inches in diameter, and up to 1 millimeter thick.

A supply of blades is on hand for most common substrates. Unusual substrates or non-standard cutting dimensions (i. e. extremely narrow kerf) may necessitate ordering special blades. There may be an extra cost to order special blades.

Useful Links:

* Must install Coral and be a trained user to reserve a slot on this system.