Support

Support Options

Submit a Support Ticket

Close

Equipment

Wire Bonder

Equipment home > Deposition > Wire Bonder

General Information:

Coral Name: kns4526
FIC: David Janes
Process/Equipment Owner: Tim Miller
Location: brk2261

System Information:

General Description:

These systems use gold wire to bond. The pad surfaces to be bonded must be compatible with gold or the bonds will not stick. Gold, copper, anuminum, or silver work well. Titanium, ITO, and diamond can not be wire bonded

Capabilities:

The West Bond bonder has 25 micron gold wire and is operated manually. The K&S bonder has a wire size of 125 microns by 25 microns and may be operated manually or by programming. The pads must be larger than the size of a wire bond foot. Wire bond feet are typically 50 microns in width and 75 microns long. The recommended pads are 100 x100 microns minimum size on both chip and package for the West Bond. 100 x 150 microns for the K&S Ribbon Bonder.

Useful Links:

* Must install Coral and be a trained user to reserve a slot on this system.