On Monday July 6th, the nanoHUB will be intermittently unavailable due to scheduled maintenance. All tool sessions will be shut down early in the morning. Home directories and tools will be unavailable most of the day. We apologize for any inconvenience this may cause. close

Support

Support Options

Submit a Support Ticket

Close

Equipment

Hotplate Bonder

Equipment home > Imaging > Hotplate Bonder

General Information:

FIC: Tim Sands
Process/Equipment Owner: Bivas Saha
Location: BRK 1217

System Information:

General Description:

Hot plate bonder for applying temperature, pressure, and inert gas ambient during bonding processes

Capabilities:


Sample size
4” diameter wafer maximum
2 independently controlled hot plates
Temperature
400°C maximum
Force sensor
999lbs maximum
Enclosure for inert gas ambient
Water cooling for quick cycling of samples
2” adapter available for improving pressure uniformity

Useful Links:

* Must install Coral and be a trained user to reserve a slot on this system.