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Equipment

Hotplate Bonder

Equipment home > Imaging > Hotplate Bonder

General Information:

FIC: Tim Sands
Process/Equipment Owner: Bivas Saha
Location: BRK 1217

System Information:

General Description:

Hot plate bonder for applying temperature, pressure, and inert gas ambient during bonding processes

Capabilities:


Sample size
4” diameter wafer maximum
2 independently controlled hot plates
Temperature
400°C maximum
Force sensor
999lbs maximum
Enclosure for inert gas ambient
Water cooling for quick cycling of samples
2” adapter available for improving pressure uniformity

Useful Links:

* Must install Coral and be a trained user to reserve a slot on this system.