nanoHUB tools will be briefly unavailable due to scheduled host maintenance on Sunday, October 1st, 2017 between the hours of 7:00 am ET and 17:00 pm ET. All tool sessions will be expired. We apologize for any inconvenience. close


Support Options

Report a problem

This page has moved to


Hotplate Bonder

Equipment home > Imaging > Hotplate Bonder

General Information:

FIC: Tim Sands
Process/Equipment Owner: Nithin Raghunathan
Location: BRK 1217

System Information:

General Description:

Hot plate bonder for applying temperature, pressure, and inert gas ambient during bonding processes


Sample size
4” diameter wafer maximum
2 independently controlled hot plates
400°C maximum
Force sensor
999lbs maximum
Enclosure for inert gas ambient
Water cooling for quick cycling of samples
2” adapter available for improving pressure uniformity

Useful Links:

* Must install Coral and be a trained user to reserve a slot on this system.