General Information:

FIC: Tim Sands
Process/Equipment Owner: Nithin Raghunathan
Location: BRK 1217

System Information:

General Description:

Hot plate bonder for applying temperature, pressure, and inert gas ambient during bonding processes

Capabilities:

Sample size
4” diameter wafer maximum
2 independently controlled hot plates
Temperature
400°C maximum
Force sensor
999lbs maximum
Enclosure for inert gas ambient
Water cooling for quick cycling of samples
2” adapter available for improving pressure uniformity

Useful Links:

• Equipment Use Fees
• Reserve System

* Must install Coral and be a trained user to reserve a slot on this system.