Coral Name: plasma_tech
Process/Equipment Owner: Bill Sheldon
Location: Cleanroom Bay K
Max Wafer Size: 6
This system is used to dry etch different substrates such as Si, SiO2, SiC, SiN, and polymers. It is also used for stripping photoresist that can't readily be stripped in the Branson.
The Plasma Tech RIE system uses Ar, O2, and SF6 gases for etching. The base pressure is less than 5.0 mTorr. The system consists of a process chamber, main unit, RF generator, pressure gauge, turbo pump controller, and automatic pressure controller.
Parallel plate RIE, no bias control.
* Must install Coral and be a trained user to reserve a slot on this system.