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Suss SB6e Substrate Bonder

Equipment home > Other > Suss SB6e Substrate Bonder

General Information:

Coral Name: sb-6e_bonder
FIC: David Janes
Process/Equipment Owner: Mike Courtney
Location: Cleanroom N Bay
Max Wafer Size: 4

System Information:

General Description:

The Suss SB6e VAC Substrate Bond Aligner is a universal tool for bonding processes for micro electro-mechanical system applications such as: Anodic Bonding (AB) Silicon Fusion Bonding (SFB) and Thermal Compression Bonding (TCB). After alignment on the BA 6 the substrate stacks are mechanically clamped using the transport fixture for further processing in the SB6e chamber.


4 inch wafer size for bonding Vacuum down to 5x10e-5 mbar. Over pressure up to 3 bar absolute Flexible process control using Windows NT with data recording and analysis Optimized bonding routines can be replicated

Useful Links:

* Must install Coral and be a trained user to reserve a slot on this system.