Dr. Kejun Xia （夏科骏） received the Ph.D. degree in Electrical Engineering at Auburn University in Dec. 2006. After graduation, he joined Maxim Integrated R&D department, where he served as a Senior Principal Member of Technical Staff leading the modeling activities for the advanced BCD & SiGe BiCMOS technologies. From 2014 to 2015, he was with the Analog & Sensor BU at Freescale Semiconductor as a modeling manager, where he expanded his experience to modeling ESD, Reliability, MEMS, product behavior model, etc. Since 2016, he joined NXP semiconductor as a modeling manager, where he is also responsible for certain fab transfer projects. Over the years, he has managed the teams in many countries including US, France, India, and China.
Dr. Xia’s research interests include device physics; compact modeling; model and its interaction with analog circuits. He is a senior member of IEEE. He has published many technical papers in renowned journals and conferences. He has been a frequent reviewer for IEEE Transactions on Electron Devices, IEEE Electron Device Letters, and Solid-state electronics. He has been on the technical program committees for the IEEE EDTM conference.