Home

Creating a Collaborative Approach to CHIPS Act Objectives and Innovation

Event Information

November 3, 2023

Purdue is hosting, with imec as a co-host an “on the hill event” entitled "Creating a Collaborative Approach to CHIPS Act Objectives and Innovation” on Nov. 3rd. The event will gather thought leaders from academia, industry, and government to explore enhancing US competitiveness in the semiconductor sector through a broad and coordinated national capabilities network. A major goal of the workshop will be to assess the current state of the art and requirements for a national infrastructure with cross-cutting capabilities to help realize the transformative objectives of the CHIPS Act. The workshop will provide an opportunity to network with and learn from other leaders whose expertise ranges from materials to chips and from design to manufacturing.

Of specific interest are online platforms to enable the community, such as Chipshub, to take us “from class to fab,” and cloud-based capabilities supporting chip design and manufacturing. Tangible outcomes from the workshop will include a report summarizing the panel discussions and connections fostered across organizations to be used to drive national actions toward creating full-stack solutions.

Agenda

7:30 AM	Doors open, check in, coffee, and light refreshments
8:00 AM	Welcome – Mark Lundstrom, Don and Carol Scifres Distinguished Professor of Electrical and Computer Engineering, Purdue University
8:15 AM	Keynote Remarks – Lora Weiss, Director, CHIPS Research & Development Office, U.S. Department of Commerce
8:25 AM	Keynote (presentation slides) – Dev Shenoy, Principal Director for Microelectronics, Office of the Under Secretary of Defense for Research and Engineering
8:50 AM	Keynote – Sri Samavedam, Senior Vice President, imec How to Enable Future Systems Scaling (Please contact speaker to request slides)
9:20 AM	Invited Talk (presentation slides) – Gerhard Klimeck, Elmore Chaired Professor, Purdue University Community Building - Global Translational Impact on Research and Education (presentation slides)
9:50 AM	Panel 1 – Physical Infrastructure for Next Generation Device Technology R&D Moderators: Zhihong Chen, Purdue University; David Hopper, imec Panelists: Dave Anderson, NY Creates Supratik Guha, Argonne National Laboratory and The Pritzker School of Molecular Engineering, University of Chicago Lode Lauwers, imec Sasikanth Manipatruni, Kepler Computing Jim Warren, NIST
10:40 AM	Break
11:00 AM	Invited Talk (presentation slides) – Kaushik Roy, Edward G. Tiedemann, Jr. Distinguished Professor of Electrical and Computer Engineering, Purdue University STCO and Full Stack Development Tradeoffs (presentation slides)
11:20 AM	Panel 2 – Creating a Design Enablement Gateway to Lower Barriers for Learners & Innovators Moderators: Alejandro Strachan, Purdue University; Raffaela Borzi, imec Panelists: Preeth Chengappa, Microsoft Antonio de la Serna, Siemens Gordon Harling, CMC Mohamed Kassem, eFabless Douglas La Tulipe, imec
12:10 PM	Lunch & vendor expo
1:10 PM	Panel 3 – Infrastructure Needs for Advanced System Integration and Packaging Moderators: Ganesh Subbarayan, Purdue University; Andy Miller, imec Panelists: John Allgair, BRIDG John Damoulakis , Cadence Design Systems Dan Kim, U.S. Department of Commerce Tom Rucker, Intel S.V. Sreenivasan, University of Texas
2:00 PM	Invited Talk (presentation slides) –Richard Gottscho, Executive Vice president and Strategic Advisor to the CEO – Innovation Ecosystem at Lam Research The Power of Virtual Process Development (presentation slides)
2:20 PM	Break
2:40 PM	Panel 4 – Developing a Domestic Workforce to Fuel Semiconductor Industry Resurgence Moderators: Kerrie Douglas, Purdue University; Abby Davis, imec Panelists: David Ely, Ivy Tech Abiodun Ilumoka, NSF Kevin Kornegay, Morgan State University Shadi Sandvik, SUNY
3:30 PM	Closing remarks – (Please contact speaker to request slides) Raj Jammy, imec
4:00 PM	Social hour
5:00 PM	Event concludes