The current state-of-the-art for large-scale InP photonic integrated circuits (PICs) is reviewed with a focus on the devices and technologies that are driving the commercial scaling of these highly integrated devices. Specifically, high-capacity dense wavelength division multiplexed (DWDM) transmitter and receiver photonic integrated circuits (PICs) are reviewed with a focus on next generation devices: >500 Gb/s and 1 Tb/s coherent multi-channel transmitter and receiver InP PICs. These large-scale PICs integrate hundreds of devices onto a single monolithic InP chip and enable significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption which enable benefits at the component and system level.
University of Illinois at Urbana-Champaign
Researchers should cite this work as follows:
MNTL 1000, University of Illinois, Urbana, IL