Support Options

Submit a Support Ticket

Home Presentation Materials Interface Structure/Surface Morphology of (Co,Fe,Ni)/Cu/Si Thin Films About

Interface Structure/Surface Morphology of (Co,Fe,Ni)/Cu/Si Thin Films

By Brian Demczyk1, R. Naik2, A. Lukaszew, G. W. Auner2, V. M. Naik3

1. None 2. Wayne State university 3. University of Michigan, Dearborn

Published on


The effects of thin film and interfacial stress on the magnetic properties Fe, Co and Ni films deposited by molecular beam epitaxy on Cu underlayers (Si substrate) were examined, employing transmission,ans scanning probe microscopy and reflection high energy diffraction. It ws found that the surface roughness determined scanning probe microscopy correlates with the interface "waviness", deduced by high-resolution electron microscopy, and serves to pull M out of plane.


Transmission electron and scanning probe microscopy was performed at the University of Michigan Electron Microbeam Analysis Laboratory.

Thin film deposition and RHEED conducted at Wayne State University.

Sponsored by

This work was supported by National Science Foundation Grant No. DMR-9321127.

Cite this work

Researchers should cite this work as follows:

  • Brian Demczyk; R. Naik; A. Lukaszew; G. W. Auner; V. M. Naik (2014), "Interface Structure/Surface Morphology of (Co,Fe,Ni)/Cu/Si Thin Films,"

    BibTex | EndNote

Tags, a resource for nanoscience and nanotechnology, is supported by the National Science Foundation and other funding agencies. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.