Carbon Nanotubes Interconnect Analyzer (CNIA)

By Sansiri Tanachutiwat1, Wei Wang2

1. College of Nanoscale Science and Engineering, University at Albany, Albany, NY, USA 2. CNSE, University at Albany

Analyze performances of carbon nanotube bundle interconnects

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Archive Version 1.1.1
Published on 19 Oct 2009, unpublished on 19 Oct 2009
Latest version: 1.1.2w. All versions

doi:10.4231/D3GF0MW1J cite this

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This tool estimates the conductance and inductance of carbon nanotube bundles for interconnect applications. The analysis is based on the bundle structure of a mixture of multi-wall and single-wall carbon nanotubes, which is a realistic structure and significantly different from other theoretical results.


The tool was developed by the nanoelectronic research group led by Dr. Wei Wang, College of Nanoscale Science and Engineering, University at Albany.


Cite this work

Researchers should cite this work as follows:

  • "Analyzing conductance of carbon nanotube bundles," IEEE Electronic Device Letters, (2007).
  • "Liwei Shang, Ming Liu, Sansiri Tanachutiwat and Wei Wang, “Diameter-dependant thermal conductance models of carbon nanotubes,” International Journal of NanoParticles, CNT special issue,(2007).
  • "Liwei Shang, Ming Liu, Sansiri Haruehanroengra, and Wei Wang, “Inductance of mixed carbon nanotube bundles,” IEE Micro and Nano Letters, vol. 2, no. 2, pp. 35-39, June 2007.
  • Sansiri Tanachutiwat; Wei Wang (2015), "Carbon Nanotubes Interconnect Analyzer (CNIA)," (DOI: 10.4231/D3GF0MW1J).

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