Transferable Tight Binding Model for Strained Heterostructures

By Yaohua Tan1, Michael Povolotskyi1, Tillmann Christoph Kubis1, Timothy Boykin2, Gerhard Klimeck1

1. Electrical and Computer Engineering, Purdue University, West Lafayette, IN 2. Electrical and Computer Engineering, University of Alabama in Huntsville, Huntsville, AL

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