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New Dimension in Performance: Harnessing 3D Integration Technology

By Kerry Bernstein

IBM T.J. Watson Research Center

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Bio

Kerry Bernstein Kerry Bernstein is a Senior Technical Staff Member at the IBM T.J. Watson Research Center, Yorktown Hts., NY. He is currently Principal Investigator of IBM’s 3D Integration Program. Mr. Bernstein received the B.S degree in electrical engineering degree from Washington University in St. Louis, and joined IBM in 1978. He holds 50 US Patents, and is a co-author of 3 college textbooks and multiple papers on high speed CMOS. His interests are in the area of high performance / low power advanced circuits and technologies. Mr. Bernstein is an IEEE Fellow.

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Researchers should cite this work as follows:

  • Kerry Bernstein (2007), "New Dimension in Performance: Harnessing 3D Integration Technology," https://nanohub.org/resources/3596.

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Knoy B033, Purdue University, West Lafayette, IN

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