Integrating Microelectronics Contexts into Engineering Classrooms: Thermo-Calc Online Tool for the Design of Solder Materials

By Congying Wang

Materials Engineering, Purdue University, West Lafayette, IN

Published on

Abstract

Run the Tool: Debugging Neural Networks In microelectronics, components are attached to circuit boards with a material that can carry the electrical signals through and form a strong mechanical bond, known as solder. The mechanical properties and joint reliability of solders strongly depend on the physical metallurgy and microstructure. Understanding the behavior of existing solders and developing new ones requires a complete understanding of the system such as solidification, aging, and intermetallic formation.

Phase diagrams are widely used in the electronics industry to determine the presence of intermetallic compounds, the melting point of alloys, and the solubility of elements at different temperatures. Thermo-Calc is an ideal computational tool to obtain such understandings for various solders.

This presentation will first present how industrial soldering practices can be contextualized into current engineering classrooms, especially in materials science, to provide students with situated learning experiences. Then we will demonstrate how Thermo-Calc can be utilized as an effective self-learning or teaching tool to solve real-world engineering problems relevant to solders.

In addition to this Video there are two additional parts to the module:

Bio

Congying Wang is a Postdoctoral Associate in the School of Materials Engineering. She holds a Ph. D. in Materials Engineering and a M.S. in Engineering Education at Purdue University in 2021. Her technical work focuses on stress relaxation mechanisms of Pb-free coatings in electronics and the sustainable end-of-life treatment of e-waste. In the engineering field, her research centers on effective pedagogies in student motivation and system thinking with a specialization in interdisciplinary education.

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Cite this work

Researchers should cite this work as follows:

  • Congying Wang (2022), "Integrating Microelectronics Contexts into Engineering Classrooms: Thermo-Calc Online Tool for the Design of Solder Materials," https://nanohub.org/resources/36098.

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Integrating Microelectronics Contexts into Engineering Classrooms: Thermo-Calc Online Tool for the Design of Solder Materials
  • Integrating Microelectronics Contexts into Engineering Classrooms 1. Integrating Microelectronics C… 0
    00:00/00:00
  • Integrating Microelectronics Contexts into Engineering Classrooms 2. Integrating Microelectronics C… 83.917250583917252
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  • Outline 3. Outline 103.50350350350351
    00:00/00:00
  • What are soldering materials? 4. What are soldering materials? 128.59526192859528
    00:00/00:00
  • Soldering in microelectronics 5. Soldering in microelectronics 208.14147480814148
    00:00/00:00
  • Solder design & Phase diagrams 6. Solder design & Phase diagrams 356.38972305638976
    00:00/00:00
  • Contextualization in materials classrooms 7. Contextualization in materials… 479.91324657991328
    00:00/00:00
  • Situated learning and student motivation 8. Situated learning and student … 510.276943610277
    00:00/00:00
  • Contextualization in materials classrooms 9. Contextualization in materials… 672.00533867200534
    00:00/00:00
  • Outline 10. Outline 735.13513513513522
    00:00/00:00
  • Thermo-Calc Educational Package 11. Thermo-Calc Educational Packag… 743.47681014347688
    00:00/00:00
  • Hands-on Demo 12. Hands-on Demo 745.47881214547886
    00:00/00:00
  • (1) Binary Phase Diagrams: Low-temperature & sustainable solders 13. (1) Binary Phase Diagrams: Low… 765.16516516516515
    00:00/00:00
  • (1) Binary Phase Diagrams: Low-temperature & sustainable solders 14. (1) Binary Phase Diagrams: Low… 868.23490156823493
    00:00/00:00
  • (1) Binary Phase Diagrams: Low-temperature & sustainable solders 15. (1) Binary Phase Diagrams: Low… 884.617951284618
    00:00/00:00
  • Hands-on Demo 16. Hands-on Demo 928.6953620286954
    00:00/00:00
  • Hands-on Demo 17. Hands-on Demo 1026.65999332666
    00:00/00:00
  • Hands-on Demo 18. Hands-on Demo 1201.801801801802
    00:00/00:00
  • (1) Binary Phase Diagrams: Low-temperature & sustainable solders 19. (1) Binary Phase Diagrams: Low… 1252.218885552219
    00:00/00:00
  • (2) Lead-free SAC Solders: Ternary Phase Diagrams 20. (2) Lead-free SAC Solders: Ter… 1352.318985652319
    00:00/00:00
  • Hands-on Demo 21. Hands-on Demo 1384.2842842842842
    00:00/00:00
  • Hands-on Demo 22. Hands-on Demo 1396.3630296963631
    00:00/00:00
  • Hands-on Demo 23. Hands-on Demo 1616.816816816817
    00:00/00:00
  • (2) Lead-free SAC Solders: Ternary Phase Diagrams 24. (2) Lead-free SAC Solders: Ter… 1653.1531531531532
    00:00/00:00
  • Hands-on Demo 25. Hands-on Demo 1658.6586586586586
    00:00/00:00
  • (2) Lead-free SAC Solders: Ternary Phase Diagrams 26. (2) Lead-free SAC Solders: Ter… 1835.301968635302
    00:00/00:00
  • (3) Failure of Solder Joints: Formation of Intermetallic Compounds 27. (3) Failure of Solder Joints: … 1839.3393393393394
    00:00/00:00
  • (3) Failure of Solder Joints: Formation of Intermetallic Compounds 28. (3) Failure of Solder Joints: … 1926.2595929262598
    00:00/00:00
  • Hands-on Demo 29. Hands-on Demo 1955.8558558558559
    00:00/00:00
  • Hands-on Demo 30. Hands-on Demo 1964.4978311644979
    00:00/00:00
  • (3) Failure of Solder Joints: Formation of Intermetallic Compounds 31. (3) Failure of Solder Joints: … 2103.5702369035703
    00:00/00:00
  • (3) Failure of Solder Joints: Formation of Intermetallic Compounds 32. (3) Failure of Solder Joints: … 2150.0166833500166
    00:00/00:00
  • (3) Failure of Solder Joints: Formation of Intermetallic Compounds 33. (3) Failure of Solder Joints: … 2230.0633967300637
    00:00/00:00
  • (3) Failure of Solder Joints: Formation of Intermetallic Compounds 34. (3) Failure of Solder Joints: … 2268.1348014681348
    00:00/00:00
  • Hands-on Demo 35. Hands-on Demo 2306.9736403069737
    00:00/00:00
  • (3) Failure of Solder Joints: Formation of Intermetallic Compounds 36. (3) Failure of Solder Joints: … 2384.8515181848516
    00:00/00:00
  • (4) Reflow Solidification Process: Scheil Solidification 37. (4) Reflow Solidification Proc… 2417.1504838171504
    00:00/00:00
  • Hands-on Demo 38. Hands-on Demo 2458.0580580580581
    00:00/00:00
  • (4) Reflow Solidification Process: Scheil Solidification 39. (4) Reflow Solidification Proc… 2596.83016349683
    00:00/00:00
  • Summary 40. Summary 2606.6066066066069
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  • Thank You 41. Thank You 2661.3279946613279
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