hotSPICE is a linear thermal circuit simulation tool. Resistors, capacitors, temperature sources and heat sources can be used in any combination to model thermal problems. Both steady-state and transient analyses can be performed. Plots can be generated for temperature at any node in the circuit, as well for heat transfer across any temperature source. hotSPICE is intended for undergraduate heat transfer students.

hotSPICE is powered by SPICE3f4, which was developed by Laurence Nagel at the University of California at Berkeley, under the direction of Donald O. Peterson.

hotSPICE was developed at Purdue University in 2008 by Andrew Schwinke under the direction of Dr. Timothy Fisher.

Source code provided by: (2005), "Spice3f4," doi:10254/nanohub-r227.1.

Researchers should cite this work as follows:

• Andrew Schwinke, Timothy S Fisher, Greg Walker (2014), "hotSPICE," https://nanohub.org/resources/hotspice. (DOI: 10.4231/D3VX0642F).

  BibTex | EndNote

1. NCN Group - Circuits
2. NCN Group - Thermal Properties
3. SPICE
4. SPICE3F4
5. thermal
6. thermal circuit