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Self-Heating Effects in Nano-Scale Devices. What do we know so far ...
10 Aug 2009 | | Contributor(s):: Dragica Vasileska, Stephen M. Goodnick
This presentation contains the research findings related to self-heating effects in nano-scale devices in silicon on insulator devices obtained at Arizona State University. Different device technologies and different device geometries are being examined. Details of the theoretical model used in...
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Illinois ECE 598EP Lecture 12 - Hot Chips: Boundary Resistance and Thermometry
17 Jul 2009 | | Contributor(s):: Eric Pop, Omar N Sobh
Boundary Resistance and ThermometryTopics: Summary of Boundary Resistance Acoustic vs. Diffuse Mismatch Model Band to Band Tunneling Conduction Thermionic and Field Emission(3D) Photon Radiation Limit Photon Conductance of Nanoconstrictions Nanoscale Thermometry Scanning Thermal Microscopy
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Illinois ECE 598EP Lecture 3.3 - Hot Chips: Electrons and Phonons
02 Mar 2009 | | Contributor(s):: Eric Pop
Electrons and PhononsTopics: Energy Stored in These Vibrations The Einstein Model Einstein Low-T and High-T Behavior The Debye Model Peter Debye (1884-1966) Website Reminder The Debye Integral Debye Low-T and High-T BehaviorThese notes were breezed and uploaded by Omar Sobh
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Illinois ECE 598EP Lecture 3.2 - Hot Chips: Electrons and Phonons
18 Feb 2009 | | Contributor(s):: Eric Pop, Omar N Sobh
Electrons and Phonons
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Illinois ECE 598EP Lecture 3.1 - Hot Chips: Electrons and Phonons
17 Feb 2009 | | Contributor(s):: Eric Pop, Omar N Sobh
Electrons and Phonons
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Illinois ECE 598EP Hot Chips: Atoms to Heat Sinks
27 Jan 2009 | | Contributor(s):: Eric Pop
This course pursues a parallel treatment of electrical and thermal issues in modern nanoelectronics, from fundamentals to system-level issues. Topics include energy transfer through electrons and phonons, mobility and thermal conductivity, power dissipation in modern devices (CMOS, phase-change...
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Illinois ECE 598EP Lecture 1 - Hot Chips: Atoms to Heat Sinks
29 Jan 2009 | | Contributor(s):: Eric Pop
IntroductionContent: The Big Picture Another CPU without a Heat Sink Thermal Management Methods Impact on People and Environment Packaging cost IBM S/390 refrigeration and processor packaging Intel Itanium and Pentium 4packaging Graphics Cards Under/Overclocking Environment A More Detailed Look...
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Thermoelectric Power Factor Calculator for Nanocrystalline Composites
18 Oct 2008 | | Contributor(s):: Terence Musho, Greg Walker
Quantum Simulation of the Seebeck Coefficient and Electrical Conductivity in a 2D Nanocrystalline Composite Structure using Non-Equilibrium Green's Functions
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Is dual gate device structure better from a thermal perspective?
01 Sep 2008 | | Contributor(s):: Dragica Vasileska, Stephen M. Goodnick
This presentation illustrates several points. First, it is shown that in nanoscale devices there is less degradation due to heating effects due to non-stationary nature of the carrier transport (velocity overshoot) in the device, which, in turn, makes less probable the interaction with phonons....
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Renaud DAVIOT
__Researcher at [http://inl.cnrs.fr/ INL]__[[BR]]Reconfigurable digital cells with CNT, Nanowires, molecular devices[[BR]]__Teaching at [http://www.cpe.fr/ CPE Lyon] (France)__[[BR]]FPGA, VHDL,...
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