Investigating the Aging Effects on the Cu, Ni and Au Intermetallic in High Temperature Solders
09 Apr 2024 | Presentation Materials | Contributor(s): Nathaniel E Weddington, Carol A Handwerker (editor), John Blendell (editor)
This presentation focuses on investigating aging effects on the Cu, Ni, and Au intermetallic in high-temperature solders. The process in which the solder joint samples are created involves the process of melting, solidification, and aging of the sample. The main topic of this presentation...
AFM And EBSD Cross-Comparison Analysis Tool
14 Aug 2018 | Presentation Materials | Contributor(s): Andrew Martin Krawec, John Blendell, Matthew John Michie
Ceramic and semiconductor research is limited in its ability to create holistic representations of data in concise, easily-accessible file formats or visual data representations. These materials are used in everyday electronics, and optimizing their electrical and physical properties is...
Surface Evolver GUI
12 Oct 2018 | Tools | Contributor(s): Kevin K Ngo, Lucas Darby Robinson, John Blendell, R. Edwin Garcia
A GUI for the Surface Evolver to simulate polycrystalline grain growth in thin films.
The Wright Flyer Crankcase: Precipitation Hardening in the First Aerospace Aluminum Alloys
11 Jul 2013 | Online Presentations | Contributor(s): John Blendell
Equilibrium Wulff Shape Generator
19 Jun 2012 | Tools | Contributor(s): R. Edwin García, John Blendell
Wulff Shape Generator