Exploring Factors Effecting Deposition, Morphology, and Thickness of Thin Metallic Layer of Copper
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Abstract
Students will create thin layers of copper and nickel in an electrochemical reaction to understand how an electric current passed through an ionic solution will result in a chemical reaction which will separate materials. In addition students will also explore the various parameters effecting deposition, morphology, and thickness of the film to be deposited. Depositing of thin film layers is a particular facet of nanotechnology that holds provocative applications in several disciplines of science that could benefit mankind.This laboratory will focus on identifying the factors that affect the surface morphology and thickness of a thin film layer of copper. Different surface structures on thin film layers could imbue the film with positive or negative attributes depending on their shape.
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Credits
NNCI Nano and Berkil Alexander
Sponsored by
NNIN RET program at Georgia Institute of Technology NSF EEC 0601939 and NNIN NSF ECCS 0335765
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