Effect of the High-k Dielectric/Semiconductor Interface on Electronic Properties in Ultra-thin Channels
15 Oct 2015 | Online Presentations | Contributor(s): Daniel A. Valencia-Hoyos, Evan Michael Wilson, mark rodwell, Gerhard Klimeck, Michael Povolotskyi
IWCE Presentation. As logic devices continue to downscale, an increasing fraction of the channel atoms are in close contact with oxide atoms of the gate. These surface atoms experience a chemical environment that is distinct from the bulk-like environment found in thicker channels. Using the non- orthogonal tight-binding method Extended Huckel Theory (EHT), III-IV/High-k dielectric interfaces are constructed and electronic structure in the two transverse directions in the plane of the interface is calculated.