Combined Microstructure and Heat Transfer Modeling of Carbon Nanotube Thermal Interface Materials

By Yide Wang1, Sridhar Sadasivam1, Timothy S Fisher1

1. Purdue University

Simulate mechanical and thermal performance of CNT thermal interface materials.

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Version 1.0 - published on 14 Apr 2015

doi:10.4231/D3SN0152F cite this

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Usage

World usage

Location of all "Combined Microstructure and Heat Transfer Modeling of Carbon Nanotube Thermal Interface Materials" Users Since Its Posting

Simulation Users

120

9 12 12 15 16 25 27 29 39 41 46 56 60 62 65 68 72 74 78 80 89 93 94 96 105 107 109 113 117 120

Users By Organization Type
Type Users
Unidentified 94 (78.33%)
Educational - University 25 (20.83%)
Industry 1 (0.83%)
Users by Country of Residence
Country Users
in INDIA 10 (40%)
us UNITED STATES 9 (36%)
ru RUSSIAN FEDERATION 2 (8%)
cn CHINA 1 (4%)
tr TURKEY 1 (4%)
bd BANGLADESH 1 (4%)
dz ALGERIA 1 (4%)

Simulation Runs

1,143

28 42 43 54 55 89 94 99 125 145 155 266 478 821 843 858 876 910 924 936 948 963 995 1006 1095 1099 1112 1123 1136 1143
Overview
Average Total
Wall Clock Time 7.58 hours 268.12 days
CPU time 3.94 hours 139.49 days
Interaction Time 11.17 minutes 6.58 days