Anisotropic Electromigration in Sn-Cu solders

This tool simulates how the microstructure of a Cu-Sn solder evolves during electromigration.

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Version 1.1 - published on 19 May 2023

doi:10.21981/DRFJ-RB54 cite this

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Abstract

This tool simulates the progression of the Cu6Sn5 intermetallic compound under current stressing using the MOOSE finite element framework. It starts with a representative microstructure of a Cu-Sn solder shortly after soldering, and the user can vary the grain orientation of Sn and the magnitude of the current density running through the simulation.

Cite this work

Researchers should cite this work as follows:

  • Andrew Minh Pham, Kyle Christian DeLay, Marisol Koslowski (2023), "Anisotropic Electromigration in Sn-Cu solders," https://nanohub.org/resources/tincopperem. (DOI: 10.21981/DRFJ-RB54).

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