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Wire bonding is used to electrically connect the processed device with the external circuit elements using small conductive wires between the bond pads of the device and the external lead frame or package. The Birck Nanotechnology Center has three types of bonding technologies: ball, ribbon, and wedge.
CMP is the process of Chemically and Mechanically Polishing the backside surface of a silicon or other material wafer. This is often used to modify the surface topology or thickness of the wafer.
The Birck Nanotechnology Center uses two very thin high-speed diamond-tipped blades to saw and separate individual die from a processes semiconductor wafer. Other materials can also be cut on the dicing saws.