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Our maskmaking capability uses three technologies: Electron beam, Laser, and optical. The technology will be chosen based upon minimum feature size of the image.

Coat and Develop

Part of the lithography process involves coating a working substrate in a photo-sensitive material and then exposing selected areas through a photomask. Once the areas are exposed, a develop process is used to chemically remove the areas not needed in the structure.

Optical Align-Expose

The Birck Nanotechnology Center uses optical aligners with 365 nm or 405 nm wavelength light to expose photoresist and transfer images from a glass plate photomask to the working substrate.

Electron-Beam Lithography

Extremely fine geometries can be created using either of two e-beam lithography systems, with feature sizes as small as 6 nanometers.