Our maskmaking capability uses three technologies: Electron beam, Laser, and optical. The technology will be chosen based upon minimum feature size of the image.
Part of the lithography process involves coating a working substrate in a photo-sensitive material and then exposing selected areas through a photomask. Once the areas are exposed, a develop process is used to chemically remove the areas not needed in the structure.
The Birck Nanotechnology Center uses optical aligners with 365 nm or 405 nm wavelength light to expose photoresist and transfer images from a glass plate photomask to the working substrate.
Extremely fine geometries can be created using either of two e-beam lithography systems, with feature sizes as small as 6 nanometers.
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